Rapid advancements in electronic technologies have resulted in progressively higher heat flux in electronic devices installed in high-power integrated circuit packages (microchips) over time. Consequently, thermal management has become a critical issue across industrial sectors,
therefore, it is important to explore new methods to improve the reliability, meet demand and extend chip lifetime. Microchannel heat sinks (MCHS) have become a highly promising solution for single-phase liquid cooling, necessitating a comprehensive assessment their current state
of development. This review steered by emerging quality and standardized exploration in microchannels and different operating parameters, and is extended with the latest studies. The primary objective of this study is to review the experimental, and numerical results, and key aspects of existing liquid cooling systems, with emphasis placed on frictional behaviour, convective heat transfer characteristics, and operational parameters influencing microchannel performance. The study aims to extend the current cooling methodologies, such as hybrid nanofluids, exploiting thermophysical properties and by integrating secondary channels. The Hybrid nano/monofluids at different volume concentrations have considerable potential working fluids for heat transport. This review consolidates recent progress in experimental practices, numerical modelling of microchannel heat sinks (MCHS), and the applicability of MCHS to single-phase active cooling techniques. It covers various heat transfer mechanisms, including structural design advancements, substrate materials, working fluids such as nanofluids with different chemical combinations and proportions synthesized to improve properties, operating conditions in terms of Reynolds number and the quantitative role of the latest optimization algorithms. Significant progress has been reported in the recent development of geometric modifications, includingribs, cavities and secondary channels, with fully developed flow models and developing flow contributes to a appreciate temperature decrease which enhance heat transfer, maximum reduction in thermal resistance. These advances also identify future opportunities for achieving greater design freedom brought by advanced manufacturing techniques to improve single-phase active cooling systems.