Heat alleviation from surfaces exposed to high heat has been of prominence with the advent of new technologies in the electronic industry. The usage of regular materials and alloys has been used to the hilt and the manufacture of new alloys being slow and with the advent of Metal Matrix Composites, their usage as heat dissipation materials has taken a front row. This is the initiation into developing an MMC of Al6061 with silver coated copper particles to be researched. The usage of Al6061 as a heat sink material and the addition of copper to it to enhance the heat dissipation capability of the material are found to yield encouraging results. This composite when further heat treated yielded even good results that surpassed the usual Al6061 capability of heat augmentation by 39%. Taguchi analysis and ANOVA are performed for the given data.