Comparison of piezoelectric fans with different geometries
1Marmara University Institute of Pure and Applied Sciences, Mechanical Engineering, Maltepe, İstanbul, 34854, Türkiye
2Marmara University Institute of Pure and Applied Sciences, Mechanical Engineering, Maltepe, İstanbul, 34854, Türkiye
3Marmara University, Faculty of Technology, Mechanical Engineering, T3-310, Maltepe, İstanbul, 34854, Türkiye
J Ther Eng 2026; 12(3): 1-10 DOI: https://doi.org/10.47481/jten.0005
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Abstract

The continuous miniaturization of electronic devices makes conventional rotary fans widely adopted in electronic systems, less practical due to their space requirements and undesirable noise generation. Hence, piezoelectric fans have attracted much attention as an alternative cooling
solu-tion, due to their compact structure, silent operation and relatively low energy consumption. In this work, the cooling performance of various configurations of piezoelectric fans are investigated with special attention to the influence of blade geometry and material choice on the thermal per-formance. Different configurations using PZT-4 piezoelectric ceramics and various blade and actuator materials were experimentally tested. Results show that the generation of airflow and the cooling capacity are highly sensitive to the blade structure design and the materials selected. The best overall performance was obtained for a stainless-steel blade design with optimized geometric characteristics, which offered a temperature decrease of 9.89 °C at a power consumption of just 22.64 mW. And wider blade geometries provided better air flow distribution and cooling efficiency than narrower blades. The choice of materials also played a key role in the performance of the actuators, with the bronze actuators outperforming the copper ones. The results indicate the close relationship between material properties, structural flexibility and geometric design in the effectiveness of piezoelectric fans. The piezoelectric coolers have advantages in size and energy efficiency, but the integration of these coolers in electronic assemblies needs careful evaluation to avoid possible vibration-related interactions or interference.