TY  - JOUR
TI  - Geometric modification and placement of high heat flux ic chips on substrates of different materials for enhanced heat transfer
AU  - DURGAM, S.
AU  - BHOSALE, A.
AU  - BHOSALE, V.
JO  - Journal of Thermal Engineering
PY  - 2023
VL  - 9
SP  - 1618
EP  - 1631
DO  - 10.18186/thermal.1401524
ER  -