@article{article752,
  title = {Geometric modification and placement of high heat flux ic chips on substrates of different materials for enhanced heat transfer},
  author = {DURGAM, S. and BHOSALE, A. and BHOSALE, V.},
  journal = {Journal of Thermal Engineering},
  year = {2023},
  volume = {9},
  pages = {1618-1631},
  doi = {10.18186/thermal.1401524}
}