TY  - JOUR
TI  - Heat transfer enhancement of electronic devices by using flexible printed circuit boards
AU  - EMAD, M.
AU  - ALJABAIR, S.
AU  - IMRAN, A.A.
JO  - Journal of Thermal Engineering
PY  - 2023
VL  - 9
SP  - 1531
EP  - 1547
DO  - 10.18186/thermal.1401009
ER  -