@article{article751,
  title = {Heat transfer enhancement of electronic devices by using flexible printed circuit boards},
  author = {EMAD, M. and ALJABAIR, S. and IMRAN, A.A.},
  journal = {Journal of Thermal Engineering},
  year = {2023},
  volume = {9},
  pages = {1531-1547},
  doi = {10.18186/thermal.1401009}
}