TY  - JOUR
TI  - Thermodynamic stability in Cu–Ta functionally graded materials using molecular dynamic simulation
AU  - Bhatt, D.
AU  - Koripella, N.
JO  - Journal of Thermal Engineering
PY  - 2026
VL  - 12
SP  - 1837
EP  - 1847
DO  - 10.47481/jten.0069
ER  -