TY  - JOUR
TI  - Highly viable nanoparticle based Thermal Interface Materials (TIM) for electronics device cooling applications
AU  - MAHESHWARI, S.U.
AU  - SOLOMON, A.B.
AU  - THILAGAVATHI, G.
AU  - HEMAMALINI, M.
AU  - ILLAKKIAM, D.
JO  - Journal of Thermal Engineering
PY  - 2025
VL  - 11
SP  - 1312
EP  - 1326
DO  - 10.14744/thermal.0000997
ER  -