TI  - Highly viable nanoparticle based Thermal Interface Materials (TIM) for electronics device cooling applications
AU  - MAHESHWARI, S.U.
AU  - SOLOMON, A.B.
AU  - THILAGAVATHI, G.
AU  - HEMAMALINI, M.
AU  - ILLAKKIAM, D.
SO  - Journal of Thermal Engineering 2025;11:1312-1326.
DO  - 10.14744/thermal.0000997