%0 Journal Article
%T Highly viable nanoparticle based Thermal Interface Materials (TIM) for electronics device cooling applications
%A MAHESHWARI, S.U.
%A SOLOMON, A.B.
%A THILAGAVATHI, G.
%A HEMAMALINI, M.
%A ILLAKKIAM, D.
%J Journal of Thermal Engineering
%D 2025
%V 11
%P 1312-1326
%R 10.14744/thermal.0000997